Plasma cleaning before coating
Plasma cleaning is an advanced surface preparation process used before applying 保形塗層 於 PCB 組裝 和 SMT 組裝. It uses ionized gas (plasma) to remove microscopic contaminants and activate the PCB surface, ensuring better coating adhesion and reliability.

How plasma cleaning works
Plasma is created by applying energy to a gas (such as oxygen, air, or argon), turning it into a highly reactive state. When exposed to the PCB surface:
- Organic contaminants (oils, flux residues) are broken down
- Particles and residues are removed at a microscopic level
- The surface energy of the PCB is increased
This process prepares the board for strong bonding with 保形塗層.
Why plasma cleaning is important
Before coating in PCB 組裝, even tiny contaminants can lead to coating defects.
Key benefits:
- Improves adhesion of 保形塗層
- Reduces risk of delamination and peeling
- Eliminates invisible residues missed by traditional cleaning
- Enhances long-term reliability in harsh environments
It is especially critical for high-reliability SMT 組裝 應用程式。.
Types of plasma used
Oxygen plasma
- Removes organic contamination effectively
- Most commonly used before coating
Argon plasma
- Provides physical cleaning (micro-etching effect)
- Helps improve surface roughness
Air plasma
- Cost-effective alternative
- Suitable for general cleaning applications
When plasma cleaning is used
Plasma cleaning is commonly applied in:
- High-reliability electronics (automotive, aerospace, medical)
- Dense or complex PCB designs
- Products exposed to moisture, chemicals, or temperature stress
- Situations where standard cleaning is not sufficient
Plasma vs traditional cleaning
Traditional cleaning (water or solvent-based):
- Removes visible contaminants
- Limited effectiveness on microscopic residues
Plasma cleaning:
- Works at molecular level
- No liquid chemicals required
- Provides superior surface activation
限制條件
- Higher equipment cost
- Requires controlled process environment
- Not always necessary for low-end applications
最後結論
Plasma cleaning is a highly effective pre-treatment process in PCB 組裝 和 SMT 組裝, ensuring optimal surface conditions before applying 保形塗層. By removing microscopic contaminants and improving adhesion, it significantly enhances coating performance and long-term reliability.
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