SMT Assembly Services
Precision-Driven Surface Mount Technology Solutions
Process Capabilities
- High-Precision Placement: Advanced equipment handles components from 01005 (0.4mm x 0.2mm) to QFN, BGA, and fine-pitch ICs (0.3mm pitch).
- Flexible Production: Supports prototypes, low-volume (<500pcs), and mass production (50,000+ pcs/month).
- Material Compatibility: Works with lead-free (RoHS), HASL, ENIG, and OSP surface finishes.
Process Flow
- Stencil Design & Solder Paste Printing: Laser-cut stencils for ±0.025mm accuracy.
- Component Placement: Ultra-precision placement at 25μm CPK.
- Reflow Soldering: 7-zone nitrogen reflow ovens with ±1°C thermal control.
- AOI & X-ray Inspection: Detects defects like tombstoning, bridging, and voids (<5% PPM).
Supported Applications
- Consumer electronics, IoT devices, automotive control modules, medical equipment.
- Mixed-technology boards (SMT + through-hole).
Production Equipment
