{"id":1554,"date":"2025-12-29T16:20:21","date_gmt":"2025-12-29T08:20:21","guid":{"rendered":"https:\/\/txjpcba.com\/?p=1554"},"modified":"2026-03-04T16:26:19","modified_gmt":"2026-03-04T08:26:19","slug":"pcba-lehi%cc%87mlemede-sik-karsilasilan-sorunlar-ve-cozumleri%cc%87","status":"publish","type":"post","link":"https:\/\/txjpcba.com\/tr\/pcba-lehi%cc%87mlemede-sik-karsilasilan-sorunlar-ve-cozumleri%cc%87\/","title":{"rendered":"PCBA Lehimleme \u0130\u015flemlerinde S\u0131k Kar\u015f\u0131la\u015f\u0131lan Sorunlar ve \u00c7\u00f6z\u00fcmleri"},"content":{"rendered":"

PCBA Lehimleme \u0130\u015flemlerinde S\u0131k Kar\u015f\u0131la\u015f\u0131lan Sorunlar ve \u00c7\u00f6z\u00fcmleri<\/h2>\r\n

Elektronik \u00fcretim d\u00fcnyas\u0131nda Bask\u0131l\u0131 Devre Kart\u0131 Montaj\u0131 (PCBA)<\/b><\/a> s\u00fcreci \u00fcr\u00fcn g\u00fcvenilirli\u011finin kalbinin att\u0131\u011f\u0131 yerdir. Bununla birlikte, bile\u015fenler mikroskobik boyutlara k\u00fc\u00e7\u00fcld\u00fck\u00e7e ve kart karma\u015f\u0131kl\u0131\u011f\u0131 artt\u0131k\u00e7a, her seferinde \u201cm\u00fckemmel bir lehim ba\u011flant\u0131s\u0131\u201d elde etmek \u00f6nemli bir zorluktur.<\/p>\r\n

Avrupal\u0131 ve Amerikal\u0131 OEM'ler i\u00e7in kalite sadece bir \u00f6l\u00e7\u00fct de\u011fil, pazara giri\u015f i\u00e7in bir gerekliliktir. PCBA lehimleme hatalar\u0131 maliyetli geri \u00e7a\u011f\u0131rmalara, saha ar\u0131zalar\u0131na ve marka itibar\u0131n\u0131n zedelenmesine yol a\u00e7abilir. A\u015fa\u011f\u0131da, en s\u0131k kar\u015f\u0131la\u015f\u0131lan PCBA lehimleme<\/strong><\/a> sorunlar ve bunlar\u0131 hafifletmek i\u00e7in m\u00fchendislik s\u0131n\u0131f\u0131 \u00e7\u00f6z\u00fcmler.<\/p>\r\n\r\n\r\n\r\n

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\"PCBA
PCBA lehimleme<\/figcaption><\/figure>\r\n
<\/figcaption>\r\n<\/figure>\r\n\r\n\r\n\r\n

1. Lehim K\u00f6pr\u00fcleme<\/h2>\r\n

Lehim k\u00f6pr\u00fcleme, lehim iki veya daha fazla biti\u015fik pedi veya ucu birbirine ba\u011flayarak istenmeyen bir elektrik yolu (k\u0131sa devre) olu\u015fturdu\u011funda meydana gelir.<\/p>\r\n

K\u00f6k Nedenler<\/h3>\r\n
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    \u015eablon Tasar\u0131m\u0131:<\/b> Yanl\u0131\u015f \u015fablon kal\u0131nl\u0131\u011f\u0131 veya a\u00e7\u0131kl\u0131k boyutu nedeniyle a\u015f\u0131r\u0131 lehim pastas\u0131 birikimi.<\/p>\r\n<\/li>\r\n

  • \r\n

    Yerle\u015ftirme Do\u011frulu\u011fu:<\/b> Y\u00fczey Montaj Teknolojisi (SMT) alma ve yerle\u015ftirme a\u015famas\u0131 s\u0131ras\u0131nda bile\u015fenlerin yanl\u0131\u015f hizalanmas\u0131.<\/p>\r\n<\/li>\r\n

  • \r\n

    Yeniden Ak\u0131\u015f Profili:<\/b> \u00c7ok k\u0131sa bir \u0131slatma b\u00f6lgesi veya \u00e7ok h\u0131zl\u0131 ula\u015f\u0131lan bir tepe s\u0131cakl\u0131\u011f\u0131.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

    \u00c7\u00f6z\u00fcmler<\/h3>\r\n
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      Diyafram A\u00e7\u0131kl\u0131\u011f\u0131 Azaltma:<\/b> \u015eablon a\u00e7\u0131kl\u0131\u011f\u0131 boyutunu \u015fu kadar azalt\u0131n 5-10%<\/b> macun ta\u015fmas\u0131n\u0131 \u00f6nlemek i\u00e7in ped boyutuna k\u0131yasla.<\/p>\r\n<\/li>\r\n

    • \r\n

      Geli\u015fmi\u015f Denetim:<\/b> Kullan\u0131m Otomatik Optik Denetim (AOI)<\/b> ve Lehim Pastas\u0131 Denetimi (SPI)<\/b> Kart yeniden ak\u0131\u015f f\u0131r\u0131n\u0131na girmeden \u00f6nce k\u00f6pr\u00fclemeyi yakalamak i\u00e7in.<\/p>\r\n<\/li>\r\n

    • \r\n

      \u0130nce Aral\u0131kl\u0131 Maskeleme:<\/b> Fiziksel bir baraj g\u00f6revi g\u00f6rmesi i\u00e7in pedler aras\u0131na y\u00fcksek kaliteli bir lehim maskesi uyguland\u0131\u011f\u0131ndan emin olun.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

        <\/ul>\r\n\r\n\r\n\r\n
        \r\n
        \"SMT
        SMT kusurlar\u0131<\/figcaption><\/figure>\r\n
        <\/figcaption>\r\n<\/figure>\r\n\r\n\r\n\r\n

        2. Mezar ta\u015flama<\/h2>\r\n

        Tombstoning, k\u00fc\u00e7\u00fck pasif bile\u015fenlerde (0201 veya 0402 diren\u00e7ler\/kapasit\u00f6rler gibi) bir ucun pedden kalkarak bile\u015fenin bir mezar ta\u015f\u0131 gibi dikey durmas\u0131na neden oldu\u011fu yayg\u0131n bir kusurdur.<\/p>\r\n

        K\u00f6k Nedenler<\/h3>\r\n
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        • \r\n

          Islatma Dengesizli\u011fi:<\/b> Bile\u015fenin bir taraf\u0131 di\u011ferinden \u00f6nce s\u0131v\u0131la\u015fma s\u0131cakl\u0131\u011f\u0131na ula\u015farak bir y\u00fczey gerilimi dengesizli\u011fi yarat\u0131r.<\/p>\r\n<\/li>\r\n

        • \r\n

          E\u015fit Olmayan Is\u0131 Da\u011f\u0131l\u0131m\u0131:<\/b> Bir pede ba\u011fl\u0131 b\u00fcy\u00fck bak\u0131r d\u00fczlemler \u0131s\u0131 emici g\u00f6revi g\u00f6rerek s\u00f6z konusu eklemin \u0131s\u0131nmas\u0131n\u0131 yava\u015flatabilir.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

          \u00c7\u00f6z\u00fcmler<\/h3>\r\n
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          • \r\n

            Termal Rahatlama:<\/b> E\u015fit \u0131s\u0131tma sa\u011flamak i\u00e7in b\u00fcy\u00fck bak\u0131r d\u00f6k\u00fcmlere ba\u011fl\u0131 pedler i\u00e7in termal tahliye izleri kullan\u0131n.<\/p>\r\n<\/li>\r\n

          • \r\n

            Profil Optimizasyonu:<\/b> Lehim erimeden \u00f6nce t\u00fcm kart\u0131n tutarl\u0131 bir s\u0131cakl\u0131\u011fa ula\u015fmas\u0131n\u0131 sa\u011flamak i\u00e7in yeniden ak\u0131\u015f profilindeki \u201c\u0131slatma\u201d s\u00fcresini uzat\u0131n.<\/p>\r\n<\/li>\r\n

          • \r\n

            Azot Ortam\u0131:<\/b> Bir nitrojen ($N_2$<\/span>) yeniden ak\u0131\u015f ortam\u0131 t\u00fcm pedlerde \u0131slatma tutarl\u0131l\u0131\u011f\u0131n\u0131 art\u0131rabilir.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

            \r\n
            \r\n
            \"Lehim
            Lehim k\u00f6pr\u00fcleme \u00e7\u00f6z\u00fcmleri<\/figcaption><\/figure>\r\n<\/figcaption>\r\n<\/figure>\r\n\r\n\r\n\r\n

            3. Lehim Bilyele\u015fmesi<\/h2>\r\n

            Lehim toplar\u0131, kendilerini lehim maskesine veya bile\u015fen g\u00f6vdelerine ba\u011flayan k\u00fc\u00e7\u00fck lehim k\u00fcreleridir. An\u0131nda bir k\u0131sa devreye neden olmasalar da daha sonra yerlerinden \u00e7\u0131kabilir ve aral\u0131kl\u0131 ar\u0131zalara neden olabilirler.<\/p>\r\n

            K\u00f6k Nedenler<\/h3>\r\n
              \r\n
            • \r\n

              Nem Kontaminasyonu:<\/b> Lehim pastas\u0131ndaki nem, yeniden ak\u0131\u015f s\u0131ras\u0131nda h\u0131zla genle\u015ferek lehim par\u00e7ac\u0131klar\u0131n\u0131 \u201cpatlat\u0131r\u201d ve da\u011f\u0131t\u0131r.<\/p>\r\n<\/li>\r\n

            • \r\n

              A\u015f\u0131r\u0131 Bas\u0131n\u00e7:<\/b> Bile\u015fen yerle\u015ftirme s\u0131ras\u0131nda \u00e7ok fazla bas\u0131n\u00e7, ped alan\u0131ndaki macunu s\u0131k\u0131\u015ft\u0131rabilir.<\/p>\r\n<\/li>\r\n

            • \r\n

              Oksidasyon:<\/b> Son kullanma tarihi ge\u00e7mi\u015f veya yanl\u0131\u015f saklanm\u0131\u015f lehim pastas\u0131 kullanmak.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

              \u00c7\u00f6z\u00fcmler<\/h3>\r\n
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              • \r\n

                S\u0131k\u0131 Depolama Protokolleri:<\/b> Lehim pastas\u0131n\u0131 iklim kontroll\u00fc ortamlarda saklay\u0131n ve yo\u011fu\u015fmay\u0131 \u00f6nlemek i\u00e7in a\u00e7madan \u00f6nce do\u011fal olarak oda s\u0131cakl\u0131\u011f\u0131na ula\u015fmas\u0131n\u0131 bekleyin.<\/p>\r\n<\/li>\r\n

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                \u00d6n pi\u015firme:<\/b> Neme maruz kalan levhalar i\u00e7in bir \u00f6n pi\u015firme d\u00f6ng\u00fcs\u00fc (\u00f6rn, 4 saat boyunca 120\u00b0C<\/b>) s\u0131k\u0131\u015fan nemi \u00e7\u0131karabilir.<\/p>\r\n<\/li>\r\n

              • \r\n

                Optimize Edilmi\u015f Conta:<\/b> \u015eablonun bask\u0131 s\u0131ras\u0131nda PCB'ye kar\u015f\u0131 m\u00fckemmel bir s\u0131zd\u0131rmazl\u0131k (conta) sa\u011flad\u0131\u011f\u0131ndan emin olun.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

                  <\/ul>\r\n\r\n\r\n\r\n
                  \r\n
                  \"PCB
                  PCB montaj\u0131nda mezar ta\u015flama<\/figcaption><\/figure>\r\n

                  \r\n

                  4. Bo\u015faltma<\/h2>\r\n

                  Bo\u015fluklar, bir lehim ba\u011flant\u0131s\u0131 i\u00e7indeki \u201ckabarc\u0131klar\u201d veya bo\u015f alanlard\u0131r. K\u00fc\u00e7\u00fck bo\u015fluklar genellikle kabul edilebilir olsa da IPC-A-610<\/b> standartlar\u0131na g\u00f6re, a\u015f\u0131r\u0131 bo\u015fluk (genellikle alan\u0131n >25%'si) eklemin mekanik b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc ve termal iletkenli\u011fini zay\u0131flat\u0131r.<\/p>\r\n

                  K\u00f6k Nedenler<\/h3>\r\n
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                  • \r\n

                    Gaz \u00e7\u0131kar\u0131yor:<\/b> Lehim kat\u0131la\u015fmadan \u00f6nce ka\u00e7mak i\u00e7in yeterli zaman\u0131 olmayan u\u00e7ucu flaks kal\u0131nt\u0131lar\u0131.<\/p>\r\n<\/li>\r\n

                  • \r\n

                    Macun Kalitesi:<\/b> Macunda y\u00fcksek seviyede oksit.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

                    \u00c7\u00f6z\u00fcmler<\/h3>\r\n
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                    • \r\n

                      Havaland\u0131rma:<\/b> \u015eablon tasar\u0131m\u0131n\u0131, gaz\u0131n ka\u00e7mas\u0131na izin vermek i\u00e7in b\u00fcy\u00fck termal pedler (QFN'lerdekiler gibi) i\u00e7in \u201cpencere b\u00f6lmesi\u201d a\u00e7\u0131kl\u0131klar\u0131 i\u00e7erecek \u015fekilde de\u011fi\u015ftirin.<\/p>\r\n<\/li>\r\n

                    • \r\n

                      Vakum Reflow:<\/b> Havac\u0131l\u0131k veya medikal gibi y\u00fcksek g\u00fcvenilirli\u011fe sahip sekt\u00f6rler i\u00e7in vakumlu yeniden ak\u0131\u015f f\u0131r\u0131n\u0131 kullanmak, erimi\u015f lehimdeki gaz kabarc\u0131klar\u0131n\u0131 \u00e7ekebilir.<\/p>\r\n<\/li>\r\n

                    • \r\n

                      Ak\u0131 Kimyas\u0131:<\/b> D\u00fc\u015f\u00fck kabarma performans\u0131 i\u00e7in tasarlanm\u0131\u015f bir flux arac\u0131 ile bir lehim pastas\u0131na ge\u00e7in.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

                      5. Islatma ve Islatmama<\/h2>\r\n
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                      • \r\n

                        Islatmaz<\/b> Lehim ped ile hi\u00e7 birle\u015fmeyi reddetti\u011finde meydana gelir.<\/p>\r\n<\/li>\r\n

                      • \r\n

                        Islakl\u0131k giderme<\/b> Lehim ba\u015flang\u0131\u00e7ta yap\u0131\u015ft\u0131\u011f\u0131nda ancak daha sonra ince, grenli bir film b\u0131rakarak geri \u00e7ekildi\u011finde meydana gelir.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

                        K\u00f6k Nedenler<\/h3>\r\n
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                        • \r\n

                          Y\u00fczey Kirlenmesi:<\/b> PCB pedlerinde veya bile\u015fen u\u00e7lar\u0131nda ya\u011f, parmak ya\u011f\u0131 veya oksitlenme.<\/p>\r\n<\/li>\r\n

                        • \r\n

                          Zay\u0131f kaplama:<\/b> D\u00fc\u015f\u00fck kaliteli PCB kaplamalar\u0131 (\u00f6rne\u011fin, bozulmu\u015f HASL veya ince ENIG).<\/p>\r\n<\/li>\r\n<\/ul>\r\n

                          \u00c7\u00f6z\u00fcmler<\/h3>\r\n
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                            Gelen Kalite Kontrol\u00fc (IQC):<\/b> PCB'lerin ve bile\u015fenlerin \u00fcretim hatt\u0131na ula\u015fmadan \u00f6nce lehimlenebilirli\u011fini test edin.<\/p>\r\n<\/li>\r\n

                          • \r\n

                            Aktif Ak\u0131\u015f:<\/b> Hafif oksidasyon katmanlar\u0131n\u0131 k\u0131rmak i\u00e7in daha aktif bir flaks kullan\u0131n (tasar\u0131m izin veriyorsa).<\/p>\r\n<\/li>\r\n

                          • \r\n

                            Do\u011fru Kullan\u0131m:<\/b> Operat\u00f6rlerin her zaman eldiven giymesini gerektiren kat\u0131 \u201cdokunmama\u201d politikalar\u0131 uygulay\u0131n.<\/p>\r\n<\/li>\r\n<\/ul>\r\n

                            \u00d6zet Tablo: H\u0131zl\u0131 Sorun Giderme K\u0131lavuzu<\/h2>\r\n\r\n\r\n\r\n\r\n\r\n\r\n\r\n\r\n\r\n
                            Problem<\/strong><\/td>\r\nBirincil Neden<\/strong><\/td>\r\n\u00d6nerilen D\u00fczeltme<\/strong><\/td>\r\n<\/tr>\r\n<\/thead>\r\n
                            K\u00f6pr\u00fcleme<\/b><\/span><\/td>\r\n\u015eablon tasar\u0131m\u0131 \/ Hizalama<\/span><\/td>\r\nDiyafram a\u00e7\u0131kl\u0131\u011f\u0131n\u0131 azalt\u0131n; SPI kontrollerini iyile\u015ftirin.<\/span><\/td>\r\n<\/tr>\r\n
                            Mezar Ta\u015flama<\/b><\/span><\/td>\r\nIslatma dengesizli\u011fi<\/span><\/td>\r\nTermal rahatlatma ekleyin; \u0131slatma b\u00f6lgesini uzat\u0131n.<\/span><\/td>\r\n<\/tr>\r\n
                            Lehim Bilyele\u015fmesi<\/b><\/span><\/td>\r\nNem \/ Son Kullanma Tarihi<\/span><\/td>\r\n\u0130klim kontroll\u00fc depolama; PCB'leri \u00f6nceden pi\u015firin.<\/span><\/td>\r\n<\/tr>\r\n
                            Voiding<\/b><\/span><\/td>\r\nS\u0131k\u0131\u015fm\u0131\u015f ak\u0131 gazlar\u0131<\/span><\/td>\r\nVakumlu yeniden ak\u0131\u015f kullan\u0131n; pencere b\u00f6lmesi kal\u0131plar\u0131.<\/span><\/td>\r\n<\/tr>\r\n
                            Islatmaz<\/b><\/span><\/td>\r\nOksidasyon \/ Kirlenme<\/span><\/td>\r\nIQC'yi iyile\u015ftirin; taze eritken\/pasta kullan\u0131n.<\/span><\/td>\r\n<\/tr>\r\n<\/tbody>\r\n<\/table>\r\n
                            \r\n

                            Sonu\u00e7: S\u0131f\u0131r Hatal\u0131 \u00dcretime Giden Yol<\/h2>\r\n

                            Elektronik \u00fcretiminin rekabet\u00e7i ortam\u0131nda, ba\u015far\u0131l\u0131 bir \u00fcr\u00fcn lansman\u0131 ile ba\u015far\u0131s\u0131zl\u0131k aras\u0131ndaki fark genellikle pcba lehimleme s\u00fcrecinin ayr\u0131nt\u0131lar\u0131na ba\u011fl\u0131d\u0131r. Titiz bir uygulama ile Dfm (\u00dcretim i\u00e7in Tasar\u0131m)<\/b> incelemeler ve son teknoloji \u00fcr\u00fcn\u00fc bir SMT hatt\u0131<\/b>, \u00fcreticileri Bat\u0131l\u0131 m\u00fc\u015fterilerin titiz standartlar\u0131n\u0131 kar\u015f\u0131layabilir.<\/p>\r\n

                            Kalite sadece sorunlar\u0131 d\u00fczeltmek de\u011fil, veriye dayal\u0131 s\u00fcre\u00e7 kontrol\u00fc ve s\u00fcrekli iyile\u015ftirme k\u00fclt\u00fcr\u00fc yoluyla sorunlar\u0131 \u00f6nlemektir.<\/p>\r\n<\/figcaption>\r\n<\/figure>\r\n\r\n\r\n\r\n\r\n","protected":false},"excerpt":{"rendered":"

                            Common Problems and Solutions in PCBA Soldering Processes In the world of electronics manufacturing, the Printed Circuit Board Assembly (PCBA) […]<\/p>","protected":false},"author":1,"featured_media":1558,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"site-sidebar-layout":"default","site-content-layout":"","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"set","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-4)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[35],"tags":[156,153,158,37,152,93,103,155,154,157],"class_list":["post-1554","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-pcba-knowledge","tag-electronic-prototype-manufacturers","tag-electronics-manufacturing","tag-pcb-smt","tag-pcba","tag-pcba-soldering","tag-pcba-supplier","tag-printed-circuit-board-assembly","tag-printed-circuit-board-companies","tag-printed-circuit-board-manufacturers","tag-turnkey-pcb-assembly-service"],"_links":{"self":[{"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/posts\/1554","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/comments?post=1554"}],"version-history":[{"count":3,"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/posts\/1554\/revisions"}],"predecessor-version":[{"id":3578,"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/posts\/1554\/revisions\/3578"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/media\/1558"}],"wp:attachment":[{"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/media?parent=1554"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/categories?post=1554"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/txjpcba.com\/tr\/wp-json\/wp\/v2\/tags?post=1554"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}